Multi-component measurement of grinding force during high speed internal thread grinding
نویسندگان
چکیده
منابع مشابه
The Measurement of Released Radionuclides during TIG-Welding and Grinding
A. Reichelt, K.-H. Lehmann, A. Reineking, E. Eder 1 Technical Inspection Agency of Southern Germany (TÜV Süddeutschland), Subdepartment Environmental Radioactivity, Westendstr. 199, D-80686 Munich, Germany 2 Isotope Laboratory for Biological and Medical Research, Georg-August-University of Göttingen, Burckhardtweg 2, D-37077 Göttingen, Germany 3 Government of Bavaria, State Ministry for State D...
متن کاملTHE EFFECT OF GRINDING TIME ON THE SPECIFIC SURFACE AREA DURING INTENSIVE GRINDING OF MINERAL POWDERS
Abstract: the changes of BET surface area of a mineral substance during intensive grinding process. Validity of the proposedmodel was tested by the experiments performed using a natural chalcopyrite mineral as well as the published data. Itwas shown that the model can predict the experimental results with a very good accuracy and can be used to predictwhat may happen under the similar experimen...
متن کاملInvestigation into Engineering Ceramics Grinding Mechanism and the Influential Factors of the Grinding Force
The grinding force is a key parameter in the grinding process, which is closely associated with the grinding mechanism of engineering ceramics, microstructure and properties of ceramic materials, and the selection of grinding parameters. Meanwhile, it is also a key indicator to assess the grindability of a material. The grinding force is a crucial parameter to reflect the grinding process, whic...
متن کاملClosed-loop force control for a semi-automatic grinding system
Automation of grinding of metalcastings is desirable for many reasons. The major reasons are dangerous working conditions, low productivity, and inconsistency in human operations. As an approach to the automating grinding process, a gantrydriven grinding machine is proposed to manipulate an industrial hand grinder and control the grinding force applied to the work piece. To increase the materia...
متن کاملIn-process force monitoring for precision grinding semiconductor silicon wafers
Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of gr...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: ACTA IMEKO
سال: 2020
ISSN: 2221-870X
DOI: 10.21014/acta_imeko.v9i5.961